Automated X-ray Inspection (AXI) at Topscom is a low cost solution ideal for verifying prototypes as well as complex boards in volume production. AXI is often paired with the electrical testing provided by Flying Probe, ICT, or functional test.

Increasing product complexity and component miniaturization have driven the need for more consistent inspection processes and alternative test methods. Topscom has responded to this need in several ways, including the addition of Automated X-ray Inspection (AXI) to our capabilities.

AXI is designed to find structural solder faults including solder opens, shorts, insufficient solder, excessive solder, missing electrical parts, and mis-aligned components. This includes non-visible joints such as area-array packages (BGA, CSP, Flip Chip), parts under RF shielding, and some connector styles. Defects are rapidly detected and repaired with almost no debug time.

The low cost, fast programming time for AXI makes the tool well suited for prototypes where an ICT is impractical. The fast inspection and debug time makes AXI an ideal tool for large, high complexity assemblies even in a volume production environment. Often AXI is used as part of a combinational strategy, pairing with Flying Probe to pick up electrical defects during prototype and initial production, and with ICT or Functional Test for more complete coverage during stable production.

AXI is another example of Topscom commitment to offering you the complete test and inspection solution.